0.8mm Female Header Double Row SMT

0.8mm Female Header Double Row SMT

· Current Rating: 0.5A Max
· Insulation Resistance: 500MΩ Min
· Dielectric Withstanding: 200V AC
· Contact Resistance: 20mΩ Max
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Products Description

 

· Current Rating: 0.5A Max
· Insulation Resistance: 500MΩ Min
· Dielectric Withstanding: 200V AC
· Contact Resistance: 20mΩ Max

 

Product Introduction

 

Applications

· Servo drives

· Material handling equipment

· IoT

· Security equipment

· Monitor

· Instrumentation and test equipment

· Audio

· Video

Specifications

· Current Rating: 0.5A Max

· Insulation Resistance: 500MΩ Min

· Dielectric Withstanding: 200V AC

· Contact Resistance: 20mΩ Max

· Operating Temperature: -40°C - +105°C

· Solderability: Reflow capable up to 260°C

Materials

· Plating: Gold flash(0.8") Standard

Higher gold available

Tin

· Contact Material: Cooper Alloy

· Housing Material: High-temperature Thermoplastic

· Environmental: UL94 V0

Others

· 2D drawing

· Contact XHS to get 3D file

· RoHS & REACH compliant

· UL compliant

 

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Features

 

● Increased life expectancy
● Improved resistance to mechanical shock
● Increased circuit density
● Improved system control

 

Advantages

 

● Traceability of Order and raw material
● Systematic lab testing ability
● Good before-sales and after-sales service
● Fast delivery time of average 4 weeks

 

Shenzhen Xuhuasheng Technology Co., Ltd.(XHS) has been devoted to the production and sale of electronic connectors for 10 years, adhering to the belief of quality first and customer first. We are a reliable manufacturer in female header socket connectors with high quality and best price. We focus on providing high value products to our customers including male header, female header, box header, wafer, FPC, RJ and wiring harness. Any demand in female header socket connectors, welcome all of you to contact us. Just call or send email to us to get professional support, believe that XHS will be your best business partner!

 

 

Packaging and Shipping

 

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Inspection Equipment

 

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Our Certificate

 

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Q&A

 

Q: How do you manage signal integrity in board-to-board connector systems?

A: 1)Match impedance
2)Minimize noise and interference
3)Maintain signal integrity in the PCB layout
4)Conduct signal integrity analysis
5)Verify connector performance
6)Follow industry standards and best practices

Q: What is the role of board-to-board connectors in reducing electromagnetic interference (EMI)?

A: 1)Shielding: Shielding is one of the most effective ways to reduce EMI in board-to-board connectors. Shielded connectors are designed with a conductive shield that surrounds the connector to block electromagnetic fields. The shield helps to prevent EMI from leaking into or out of the connector and can reduce the impact of EMI on nearby circuits.

2)Grounding: Grounding is another way to reduce EMI in board-to-board connectors. The connector should be connected to a common ground plane on both PCBs to reduce the potential difference and minimize the impact of EMI. Proper grounding can help to reduce noise and interference in the system.

3)Filtering: Filtering is a technique that can be used to reduce EMI in board-to-board connectors. Filtering components, such as capacitors or inductors, can be added to the connector to filter out high-frequency noise and reduce the impact of EMI.

4)Layout: The layout of the board-to-board connector system can also affect EMI. The distance between the connector and other components on the PCB, the placement of the connector on the PCB, and the orientation of the connector can all affect EMI. Careful design and layout can help to minimize the impact of EMI.

By using shielded connectors, proper grounding, filtering, and careful layout, board-to-board connectors can help to reduce EMI in electronic systems. Proper EMI reduction is critical to ensure the reliability and performance of electronic systems, particularly in high-speed or high-precision applications.

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