Product Overview and Functions
This product is a 0.8mm Pitch Double Row Side Entry SMT Female Header, specifically designed for space-constrained, high-density interconnection. The side-entry structure allows insertion and removal parallel to the PCB surface, making it ideal for thin devices or lateral connection requirements.
Main Functions:
- Enables high-density board-to-board or board-to-FPC/wire harness connections.
- SMT placement supports automated production, improving efficiency.
- The double-row structure increases pin density, meeting the needs of miniaturized electronic products.
- Provides a stable, low-cost signal transmission solution.
Materials and Structure
- Insulator/Housing: High-temperature Thermoplastic (e.g., PBT, PA6T, or LCP), UL94 V-0 flame retardant rating.
- Contacts: Copper Alloy.
- Surface Plating:
- Standard: Gold Flash (0.8μ")
- Optional: Higher gold thickness or Tin plating.
- Structural Features:
- Pitch: 0.8 mm.
- Double Row.
- Side Entry SMT (surface mount technology), insertion and removal direction parallel to PCB.
- Low profile design to meet miniaturization requirements.
- Main Electrical and Mechanical Specifications
| Rated Current | 1A Max (per pin) |
| Contact Resistance | 20mΩ Max |
| Insulation Resistance | 1000MΩ Min |
| Dielectric Withstanding Voltage | 500V AC |
| Operating Temperature | -40°C ~ +105°C |
| Soldering Heat Resistance | Reflow soldering up to 260°C |
| Other | RoHS & REACH compliant, UL certified |
Others
· 2D drawing
Application Scenarios
Suitable for miniaturized, high-density electronic products, primarily including:
- Servo Drives
- Material Handling Equipment
- Frequency Converters
- Stereo Amplifiers
- LED Screens
- Instrumentation and Test Equipment
- Audio & Video
- Consumer electronics, IoT devices, medical equipment, industrial control modules, and other applications requiring compact layouts.
Applications in LED displays or audio equipment motherboards (thin space utilization)
Key Features
- Side Entry Advantages: Insertion and removal directions are parallel to the PCB, significantly reducing device thickness and making it suitable for ultra-thin designs.
- Main Applications: Servo drives, frequency converters, LED displays, audio equipment, industrial control modules, medical instruments, etc.
- SMT Characteristics: Suitable for automated mass production.
Technical Documentation and Other Information
- Technical Documentation: Basic specifications are provided on the page; 2D images are available for viewing; 3D files must be obtained by contacting sales.
- Certifications: RoHS, REACH, UL, HF, etc.
- Customization: Supports different pin counts, plating thicknesses, and packaging methods (Tape & Reel suitable for SMT automation).
- Packaging and Delivery: Professional packaging is available, suitable for international shipping.
- Contact: Email: ron.ye@126.com; WhatsApp/WeChat: +8613902450680.
Precautions:
- The Side Entry design dictates that the insertion/removal direction is parallel to the PCB. Care must be taken regarding PCB layout and alignment accuracy during installation.
- Strictly adhere to the temperature profile during SMT reflow soldering to avoid damaging the plastic casing.
- Compared to the previously searched 0.8mm double-row straight-through SMT version, this one is a side-entry type, making it more suitable for specific installation orientation requirements.
If you need images of this 0.8mm Double Row Side Entry SMT Female Header in actual application scenarios (SMT soldering on PCB, side-entry connection illustration, equipment application, etc.), please let me know and I can provide them immediately!
Packaging and Shipping
Inspection Equipment
Our Certificate
FAQ
Q: Can you provide samples? What is the sample lead time?
A: Free sample requests are supported. Sample delivery time is typically 3 days to 2 weeks, depending on material inventory.
Q: What causes components to become loose after SMT soldering?
A: Common causes include: insufficient soldering temperature leading to incomplete solder melting; and PCB pads being too small, resulting in insufficient soldering area. Solutions include adjusting the reflow temperature profile and optimizing the pad design to increase the soldering area.
Q: How to resolve poor contact and unstable signals during use?
A: First, check the contact surfaces for oxidation, oil, dust, or other impurities. Second, avoid frequent plugging and unplugging (the typical plugging and unplugging life of this type of connector is less than 1000 cycles). Maintain horizontal force during plugging and unplugging to avoid damaging the terminal elasticity.
Q: What are some precautions for PCB design?
A: Strictly adhere to the manufacturer's official Gerber pad files. For high-current pins, it is recommended to add thermal vias to assist heat dissipation and prevent overheating that could cause the pads to detach.
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